F450C and G450C Members Meet at SUNY Poly’s Albany Site

As part of ongoing face-to-face engagement between the F450C and G450C, members of both consortia gathered recently at M+W Group’s headquarters at the State University of New York Polytechnic Institute’s College of Nanoscale Science & Engineering (CNSE), nestled in the emerging technology hub in upstate New York, to discuss the status of facilities infrastructure projects […]

Water Treatment Considerations for 450mm Fabs

While the F450C addresses many of the larger infrastructure challenges in the transition to 450mm wafer sizes, water treatment systems are affected only minimally. Still, it’s important to consider the impact of this transition, as water treatment is critical to the wafer fabrication processes, especially as we’re simultaneously scaling to smaller nodes. Per wafer, although […]

Hidden Costs of Toxic Gas Abatement

In transitioning from 300mm to 450mm wafer processing, the surface area of each wafer approximately doubles and so the mass of direct materials used in deposition and etch chambers can be expected to increase accordingly. Consequently, the cost to deliver and abate process chemicals will likewise double…unless we re-examine how our process tools are integrated […]

Sustainability of Future Fabs with Smart Utilities

Ben Peek began his career as a research chemist with Texas Instruments, R&D Labs, in the 1960s. His interest was surface chemistry (flat surfaces) and basic research in exotic semiconductor materials such as gallium arsenide (GaAs), germanium, indium phosphide (InP), indium antimonide (InSb), and mercury cadmium telluride (HgCdTe). These materials are today’s mainstays for speed […]